MOISTURE ABSORBING AND RELEASING BOARD AND MANUFACTURE THEREOF

Japanese Patent JP3485730

B2

PROBLEM TO BE SOLVED: To reduce energy necessary for an air-conditioning equipment while maintaining strength of a board by arranging a silica gel mixed layer on the surface side of a moisture absorbing releasing board being a gypsum board, and adjusting moisture by directly contacting moisture-containing air with the silica gel mixed layer.
SOLUTION: A gypsum paste layer is flowed onto a silica gel mixed gypsum paste layer, and a gypsum board 20 is formed. It is arranged on the inside of furring strips 25 extended on the inside of a stud 24 through a moisture permeable waterproof sheet 26 by putting the slica gel mixed layer 21 side on the indoor side. A heat insulating material 24 is inserted between studs 24, and a gas permeable backing material 29 and an exterior trimming material 30 are stretched on the outside of the stud 24 through a moisture permeable waterproof sheet 28. Air in a room directly contacts with a slica gel mixed layer 21 of the gypsum board 20, and silica gel being a contained component absorbs moisture at high humidity time, and releases moisture at low humidity time, and moisture in the room is adjusted. Dew condensation on a surface of the gypsum board 20 is prevented, and the deterioration of heat insulating performance is also prevented.

JP2001207557	INTERIOR STRUCTURE OF CONCRETE WALL
JPH08270086	DRAIN PIPE
JP2022047730	BATHROOM PANEL

Shiro Nakajima

JP21945096A

January 13, 2004

July 31, 1996

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Nichiha Co., Ltd.

E04B1/64; B32B13/04; C04B14/04; C04B28/14; C04B32/02; E04F13/14; (IPC1-7): E04F13/14; B32B13/04; C04B14/04; C04B28/14; C04B32/02; E04B1/64

JP7113272A
JP81631A
JP959052A
JP60129413U

Tadao Usami

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