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Title:
MOISTURE-CURABLE URETHANE HOT-MELT RESIN COMPOSITION AND LAMINATE
Document Type and Number:
Japanese Patent JP2020094126
Kind Code:
A
Abstract:
To provide a moisture-curable urethane hot-melt resin composition excellent in initial adhesive strength.SOLUTION: The present invention provides: a moisture-curable polyurethane hot-melt resin composition which contains an urethane prepolymer (i) having isocyanate groups and a photopolymerization initiator (ii), the urethane prepolymer (i) using as essential raw materials a polyol (A) containing a polycaprolactone polyol (a1), a polyisocyanate (B), and a compound (C) having one or more (meth)acryloyl groups and one or more hydroxyl groups; and a laminate having a cured product layer of the moisture-curable polyurethane hot-melt resin composition. The compound (C) is preferably 2-hydroxyethyl (meth)acrylate.SELECTED DRAWING: None

Inventors:
MIURA TAKASHI
FUJIWARA TOYOKUNI
NINOMIYA ATSUSHI
Application Number:
JP2018232590A
Publication Date:
June 18, 2020
Filing Date:
December 12, 2018
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08G18/30; B32B27/40; C08G18/08; C08G18/42; C08G18/67; C08K5/07; C08L75/04
Domestic Patent References:
JP2008063406A2008-03-21
JP2009197053A2009-09-03
JP2015086291A2015-05-07
JP2008063407A2008-03-21
JP2011225636A2011-11-10
JP2016204541A2016-12-08
JP2013001833A2013-01-07
JPH0693066A1994-04-05
JP2017165948A2017-09-21
Foreign References:
US20040079482A12004-04-29
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno