Title:
MOISTUREPROOF INSULATING COATING MATERIAL, ELECTRONIC PART SUBJECTED TO INSULATION TREATMENT AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2005126456
Kind Code:
A
Abstract:
To obtain a heat-resistant moistureproof insulating coating material suitable for moistureproof insulation, or the like, and having excellent adhesion to a substrate, and to provide an electronic part subjected to insulation treatment and a method for producing the same.
The moistureproof insulating coating material comprises (a) 10-40 pts. wt. of a thermoplastic resin, (b) 1-20 pts. wt. of a pressure-sensitive adhesion imparting resin, (c) 0.1-5 pts. wt. of a silane coupling agent and (d) 50-90 pts. wt. of a solvent.
Inventors:
SUZUKI MASAHIRO
SHIGA SATOSHI
SHIGA SATOSHI
Application Number:
JP2003360186A
Publication Date:
May 19, 2005
Filing Date:
October 21, 2003
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B05D5/00; B05D7/00; B05D7/24; C09D5/25; C09D7/12; C09D153/02; C09D157/02; C09D193/04; C09D201/00; (IPC1-7): C09D201/00; B05D5/00; B05D7/00; B05D7/24; C09D5/25; C09D7/12; C09D153/02; C09D157/02; C09D193/04
Domestic Patent References:
| JPH051267A | 1993-01-08 | |||
| JP2003145687A | 2003-05-20 | |||
| JPH01261478A | 1989-10-18 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu