MOISTUREPROOF PACKAGING BAG FOR SEMICONDUCTOR

Title:

MOISTUREPROOF PACKAGING BAG FOR SEMICONDUCTOR

Document Type and Number:

Japanese Patent JP2002274594

Kind Code:

A

Abstract:

To provide a moistureproof packaging bag for semiconductors, whose barrier properties with respect to steam or oxygen are less reduced even by handling such as a bag-making machining and moreover whose weight is reduced without detriment to practical strength.

The moistureproof packaging bag for semiconductors is made of a laminated film formed by laminating a base film, a barrier layer and a heat-sealed layer on one another. In this packaging bag, the barrier layer is formed of an aluminum foil having tensile elongation = 3% or more.

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Inventors:

YAGI MASAHIRO
KUNII HISAYOSHI
HIRAKAWA KATSUYOSHI

Application Number:

JP2001075987A

Publication Date:

September 25, 2002

Filing Date:

March 16, 2001

Export Citation:

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Assignee:

ASAHI KASEI PAX CORP
TOSHIBA CORP

International Classes:

B65D30/02; B32B15/08; B65D65/40; B65D85/86; (IPC1-7): B65D85/86; B32B15/08; B65D30/02; B65D65/40

Attorney, Agent or Firm:

Hidetake Komatsu (4 outside)

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