Title:
MOLD APPARATUS FOR INJECTION MOLDING AND METHOD FOR INJECTION MOLDING
Document Type and Number:
Japanese Patent JP2002178375
Kind Code:
A
Abstract:
To provide a mold apparatus for injection molding and a method for injection molding capable of preventing a deformation of a molding by uniformly holding a mold release balance in the case of releasing the molding by alleviating a close contact force between the molding and a mold.
The method for injection molding comprises the steps of measuring the close contact force between the molding 23 and a dowel 35 of a movable mold in the case of releasing the molding 23, and vibrating the dowel 35 by vibrating units 24 and 25 based on a measured result of the force.
Inventors:
KURIHARA HIDEO
Application Number:
JP2000384331A
Publication Date:
June 26, 2002
Filing Date:
December 18, 2000
Export Citation:
Assignee:
CANON KK
International Classes:
B29C45/40; B29C45/76; (IPC1-7): B29C45/40; B29C45/76
Attorney, Agent or Firm:
Yoshikazu Tani (1 person outside)
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