To provide a mold clamping force control method which not only raises the rigidity of an device but also shortens the period until desired mold clamping force is generated to thereby improve the rising characteristics in a mold clamping process in a mold clamping device which generates a mold clamping force with an electromagnet, and to provide the mold clamping device.
The mold clamping device 10 which generates mold clamping force with electromagnet 49 includes coil 8 (48), coil holding section 3 (13) holding coil 8 (48), and suction plate 22 which is prepared to face coil holding section 3 (13), wherein a slit 1 in which a depth is prepared in a direction which intersects perpendicularly with the surface is formed on at least one surface of a surface in which coil holding section 3 (13) faces a suction plate 22 and a surface in which the suction plate 22 faces a coil holding section 3 (13).
MORITA HIROSHI
YAMAMOTO TAIZO
| JP2003318025A | 2003-11-07 | |||
| JP2000251590A | 2000-09-14 | |||
| JP2004259570A | 2004-09-16 | |||
| JPH11126715A | 1999-05-11 | |||
| JPH0560825U | 1993-08-10 |
| WO2005090052A1 | 2005-09-29 |
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