Title:
型締装置
Document Type and Number:
Japanese Patent JP7260582
Kind Code:
B2
Abstract:
To enable weight reduction of a stationary platen or a movable platen of a mold clamping device, or to shorten a whole length of the mold clamping device.SOLUTION: A mold clamping device 2 comprises: a mold opening/closing mechanism 15 for moving a movable platen 14, on which a movable mold 13 is mounted, with respect to a stationary platen 12, on which a stationary mold 11 is mounted, along tie bars 24 in a mold opening/closing direction; an ejector mechanism 72 disposed on a back side of the stationary platen 12 or the movable platen 14 in the mold clamping device 2 provided with a mold clamping mechanism 16 for mold-clamping the stationary mold 11 and the movable mold 13, to push out a molded article from a cavity surface 86 of the stationary mold 11 or the movable mold mounted on mold mounting surfaces 20 and 30 on a facing front side on the opposite side to the back side: thick wall parts 58 formed on four corner sides in a recess 57 on the back side of the stationary platen 12 or the movable platen 14; and a thick wall part 60 formed on a bottom other than the thick wall parts 58 in the recess 57 on the back side of the stationary platen 12 or the movable platen 14.SELECTED DRAWING: Figure 3
Inventors:
Kura Tajima
Hiroki Hasegawa
Hiroki Hasegawa
Application Number:
JP2021056950A
Publication Date:
April 18, 2023
Filing Date:
March 30, 2021
Export Citation:
Assignee:
Japan Steel Works, Ltd.
International Classes:
B29C45/64; B22D17/26; B22D18/02
Domestic Patent References:
| JP2019031072A | ||||
| JP2013244740A | ||||
| JP62158308A |
Attorney, Agent or Firm:
Ken Ieiri
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