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Title:
MOLD FOR COMPRESSION MOLDING, COMPRESSION MOLDING APPARATUS, AND COMPRESSION MOLDING METHOD
Document Type and Number:
Japanese Patent JP2013226693
Kind Code:
A
Abstract:

To enable a film to be adhesion-coated on a surface of a mold for compression molding without being wrinkled, in compression molding using the film.

A mold for compression molding includes a lower mold 1A and a upper mold 1B constituting a cavity C, a first suction groove 5 for sucking and holding a mold release film 4 and a second suction groove 6 sucking the mold release film 4 inside the first suction groove 5 radially are provided in a upper surface being a cavity outside, of the lower mold 1A. A groove side surface s2 on the cavity side in the second suction groove 6 is formed into an inclined surface more gentle than that of a groove side surface s1 on the outside radially to make a cross section shape of the second sucking groove 6 be inside/outside asymmetrical and widened upward.


Inventors:
KAWAMOTO YOSHIHISA
Application Number:
JP2012099908A
Publication Date:
November 07, 2013
Filing Date:
April 25, 2012
Export Citation:
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Assignee:
TOWA CORP
International Classes:
B29C43/36; B29C33/68; B29C43/18; B29C43/32
Domestic Patent References:
JP2010264704A2010-11-25
JP2009272398A2009-11-19
Attorney, Agent or Firm:
Kazuhide Okada