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Title:
MOLD CONNECTOR AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008258103
Kind Code:
A
Abstract:

To provide a mold connector which can secure high water-proofness and its manufacturing method.

The mold connector M is provided with a terminal metal fitting 20 fixed on a core wire 32 of which the insulation cover 31 of a wire 30 is peeled and exposed and a molded resin portion 40 formed by molding a portion including this fixed portion and a top end portion of the insulation cover 31 by a synthetic resin. On an end portion opposite to the top end of the wire 30 out of the molded resin portion 40, a cylindrical projected portion 46 is integrally provided surrounding the insulation cover 31, and on a projected end portion of the cylindrical projected portion 46, there is a coating of a sealant 48 which seals between an inner circumferential portion of the cylindrical projected portion 46 and the insulation cover 31 over an outer circumferential surface of the insulation cover 31 of the wire 30 extending from the projected end portion through an outer circumferential surface of the cylindrical projected portion 46.


Inventors:
SAWADA TAKASHI
Application Number:
JP2007101796A
Publication Date:
October 23, 2008
Filing Date:
April 09, 2007
Export Citation:
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Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H01R13/52; H01R13/405; H01R13/648; H01R43/00; H01R43/24
Attorney, Agent or Firm:
Arisa Ushiro
Jiro Murakami
Keiko Mizusawa



 
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