Title:
ホットスタンピング用金型冷却装置
Document Type and Number:
Japanese Patent JP6580740
Kind Code:
B2
Abstract:
A cooling apparatus consisting of a pump (210), a pre-heater (220), a control valve (240), a condenser (320) and a reservoir (100) for a hot stamping die (10) is configured such that a refrigerant in a two-phase coexisting state of a liquid phase and a gas phase is supplied to a cooling channel formed in the hot stamping die to cool the hot stamping die using latent heat of the refrigerant. The refrigerant maintains a constant temperature in the cooling channel of the hot stamping die, which ensures uniform cooling of the hot stamping die.
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Inventors:
Park St. Dragon
Hanbara Benefits
Youn
Shun Shun tiger
Money
Hanbara Benefits
Youn
Shun Shun tiger
Money
Application Number:
JP2018062051A
Publication Date:
September 25, 2019
Filing Date:
March 28, 2018
Export Citation:
Assignee:
MS AUTOTECH CO.,LTD.
Myeongshin Industry Company Limited
Myeongshin Industry Company Limited
International Classes:
B21D24/00; B21D37/16
Domestic Patent References:
JP11037610A | ||||
JP61046211B2 | ||||
JP3119153B2 | ||||
JP6353558B2 | ||||
JP2747045B2 | ||||
JP2000210940A | ||||
JP2008055709A | ||||
JP3057520A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki