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Title:
金型冷却装置及び金型冷却方法
Document Type and Number:
Japanese Patent JP7151135
Kind Code:
B2
Abstract:
To provide a mold cooling device and a mold cooling method smoothly fluidizing a coolant, and further, suppressing coolant leakage from a cooling flow passage, thus capable of improving quality defects caused by a change in cooling capacity.SOLUTION: A mold cooling device 101 comprises a first negative pressure generation part 15, a second negative pressure generation part 22 and a control part 23. The first negative pressure generation part is provided at the side of an outlet 4 in a cooling flow passage 2, generates negative pressure upon cooling of a mold and sucks a coolant in the cooling flow passage. The second negative pressure generation part is provided at the side of an inlet 3 in the cooling flow passage, and generates negative pressure. The control part controls the first negative pressure generation part and the second negative pressure generation part in such a manner that the value of the first pressure as the generation pressure by the first negative pressure generation part is made lower than the value of the second pressure as the generation pressure by the second negative pressure generation part.SELECTED DRAWING: Figure 1

Inventors:
Hitoshi Yokoya
Takeshi Arai
Naoto Uesaka
Inoue Makoto
Masayoshi Mori
Application Number:
JP2018071018A
Publication Date:
October 12, 2022
Filing Date:
April 02, 2018
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
B22D18/06; B22C9/06; B29C33/04
Domestic Patent References:
JP6190529A
JP2010099698A
JP3088726U
JP11170024A
JP8243713A
JP2000176940A
JP2016010813A
JP2012254605A
JP63028699B2
JP2004160866A
JP2014159134A
Foreign References:
WO2006098152A1
Attorney, Agent or Firm:
Hattori Masaki