Title:
MOLD DISASSEMBLING DEVICE
Document Type and Number:
Japanese Patent JP2022150554
Kind Code:
A
Abstract:
To provide a mold disassembling device capable of reducing a residual sand rate.SOLUTION: A mold disassembling device 10 comprises a mold side tilting apparatus 30 side-tilting a molten metal pouring-finished mold 26 having a runner extending in a vertical direction after molten metal pouring so that the runner extends to a horizontal direction. The side-tilted molten metal pouring-finished mold 26 is transported to a vibration application apparatus 40 by a mold transportation apparatus 80 in this side-tilted state. The vibration application apparatus 40 comprises a mold mounting part 45 mounting the side-tilted molten metal pouring mold 26 and applies vibration with respect to the molten metal pouring-finished mold 26 mounted in the side-tilted state. By the vibration, mold sand 22 falls from the molten metal pouring mold 26 so as to be removed.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
NAKAMURA HISAYOSHI
Application Number:
JP2021053200A
Publication Date:
October 07, 2022
Filing Date:
March 26, 2021
Export Citation:
Assignee:
AISIN TAKAOKA LTD
International Classes:
B22D29/04
Attorney, Agent or Firm:
Yamada Tsuyoshi
Previous Patent: LEARNING DATASET GENERATION DEVICE AND METHOD
Next Patent: Shot blasting method for castings
Next Patent: Shot blasting method for castings