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Patent Searching and Data


Title:
MOLD FOR HIGH HEAT EFFICIENCY INJECTION MOLDING, AND INJECTION MOLDING METHOD
Document Type and Number:
Japanese Patent JP2013166314
Kind Code:
A
Abstract:

To provide a method of manufacturing a molded article with excellent quality and productivity by enabling heat exchange of a product transfer surface with high efficiency.

Highly-efficient heat exchange is made possible by including assist blocks which abut on a cavity block and a core block directly relating to heat conduction of filled resin, and increase a heat conduction area of mold temperature control. More preferably, a heat shield layer formed of a low-heat conductivity member and an air insulation layer are included in a fitting and abutting part between the cavity block and a mold base for supporting and fixing the core block.


Inventors:
SUDO MITSURU
Application Number:
JP2012031233A
Publication Date:
August 29, 2013
Filing Date:
February 16, 2012
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
B29C45/73; B29C45/00
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki