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Patent Searching and Data


Title:
MOLD FOR INJECTION MOLDING INTEGRATED WITH CONTROLLER
Document Type and Number:
Japanese Patent JP3467206
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a mold for injection molding integrated with a controller which can eliminate a connector box, a junction circuit, internal wiring, and others. can obviate a compensating lead, and can accomplish rationalization including optimization of a control capacity. miniaturization. resources saving, space saving, and price reduction.
SOLUTION: In a molding 2 for injection molding used in an injection molding machine, a control unit 1a is miniaturized, the unit 1a and the mold 2 are integrated. In the unit 1a for meeting the conditions of material supply, various elements constituting the unit 1a are embedded in the nonmovable part of the mold 2, and wiring and a control box are eliminated.


Inventors:
Uesugi, Tomohiko
Application Number:
JP1999000070160
Publication Date:
November 17, 2003
Filing Date:
March 16, 1999
Export Citation:
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Assignee:
SEIKI CORP
International Classes:
B29C45/26; B29C45/17; B29C45/73; B29C45/76; B29C45/27; B29C45/78; (IPC1-7): B29C45/26; B29C45/73; B29C45/76
Attorney, Agent or Firm:
丹羽 宏之 (外1名)