Title:
型内被覆組成物及び型内被覆成形体
Document Type and Number:
Japanese Patent JP4590473
Kind Code:
B2
Abstract:
[PROBLEMS TO BE SOLVED] There are provided an in-mold coating composition having an excellent adhesion to a thermosetting molding resin or a thermoplastic molding resin and an in-mold-coated molded product formed by coating effectively with a conductive coating film in a mold. [SOLUTION] This invention is an in-mold coating composition characterized by comprising components of (A) at least one selected from a urethane oligomer, an epoxy oligomer, a polyester oligomer and a polyether oligomer each having a (meth)acryloyl group, or an unsaturated polyester resin, (B) a monomer capable of copolymerizing with the (A) component, (C) a conductive particle formed by coating a surface of an inorganic particle with a conductive metal oxide particle, and (D) an organic peroxide polymerization initiator, wherein mass ratios of the (A) and (B) components satisfy (A)/(B) = 20/80-80/20, a mass ratio of the (C) component satisfies (C)/{(A)+(B)} = 5/100-50/100, and a mass ratio of the (D) component satisfies (D)/{(A)+(B)} = 0.1/100-5/100, and an in-mold-coated molded product using the composition.
Inventors:
Kenji Daejeon
Shinichiro Joza
Kenji Yonemochi
Shinichiro Joza
Kenji Yonemochi
Application Number:
JP2008314713A
Publication Date:
December 01, 2010
Filing Date:
December 10, 2008
Export Citation:
Assignee:
Dainippon Paint Co., Ltd.
International Classes:
C08F283/01; B29C45/16; C08F290/06; C09D4/00; C09D5/24; C09D7/62; C09D163/10; C09D167/06; C09D167/07; C09D171/00; C09D175/16; B29L9/00; C08F2/44
Domestic Patent References:
| JP2009051124A | ||||
| JP2006257370A | ||||
| JP2006257369A | ||||
| JP2006257368A | ||||
| JP2003137943A |
Attorney, Agent or Firm:
Michio Nagai
Jyohei Yamashita
Jyohei Yamashita