To provide a mold and a method for producing the mold, which allow release of a duplicated plate formed on a groove-ridge shape of a Si original plate without generating chipped ridge portions of the duplicated plate.

The method for producing a mold 10 having a fine groove-ridge pattern on the surface thereof includes: a release layer forming step of forming, on a surface of the Si original plate 26 having a groove-ridge pattern, a release layer 16 made of a metal film containing a metal having an ionization tendency lower than that of hydrogen, for example, at least one metal selected from the group consisting of Pt, Os, Ir, Au, Ru and Pd; an electroforming step of electroforming, after the release layer 16 has been formed, a metal substrate 12 forming a mold; and a releasing step of releasing a duplicated plate including the release layer 16 and the metal substrate 12 from the Si original plate 26 after the electroforming step.