Title:
金型および金型の製造方法
Document Type and Number:
Japanese Patent JP7258193
Kind Code:
B2
Abstract:
To provide a mold in which a molding product is evenly cooled.SOLUTION: Provided is a mold with a tabular shape having a molding surface 12a and a reverse surface 12b, which comprises a mold body 12 whose thickness is substantially constant except a columnar body 33 projecting from the reverse surface. The mold comprises a support base having: an attachment surface 15 to which the reverse surface 12b of the mold body 12 is adhered; and an attachment seat 27 for a columnar body 33. The mold comprises a refrigerant passage through which a refrigerant for cooling the molding surface 12a of the mold body 12 flows. The refrigerant passage is configured in such a manner that the mold body 12 covers a groove 16 of the attachment surface 15, and forms the one groove 16 by avoiding the attachment seat 27. The groove 16 has a plurality of linear parts 16a, and a plurality of folded-back parts 16b connected to both ends of the linear parts 16a to be bent. The linear parts 16a are arranged at intervals, and the folded-back parts 16b connect together the ends of the two linear parts 16a adjacent to each other in such a manner that the refrigerant flows successively through all the linear parts 16a.SELECTED DRAWING: Figure 2
Inventors:
Hiroki Itoi
Takashi Nagatomo
Seiya Tanaka
Takashi Nagatomo
Seiya Tanaka
Application Number:
JP2022004134A
Publication Date:
April 14, 2023
Filing Date:
January 14, 2022
Export Citation:
Assignee:
G-TEKT CORPORATION
International Classes:
B21D37/02; B21D37/16
Domestic Patent References:
| JP2013099774A | ||||
| JP2011161449A | ||||
| JP2003231915A | ||||
| JP57086028U |
Foreign References:
| CN208527847U | ||||
| KR101365195B1 | ||||
| US20090293571 |
Attorney, Agent or Firm:
Shigeki Yamakawa
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