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Title:
モールド金型、樹脂モールド装置及び樹脂モールド方法
Document Type and Number:
Japanese Patent JP6438794
Kind Code:
B2
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Inventors:
Yuichi Takahashi
Sato Hisashi
Application Number:
JP2015028595A
Publication Date:
December 19, 2018
Filing Date:
February 17, 2015
Export Citation:
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Assignee:
Apic Yamada Corporation
International Classes:
H01L21/56; B29C45/02
Domestic Patent References:
JP2014222711A
JP2012195330A
Foreign References:
US20130140737
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office



 
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