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Patent Searching and Data


Title:
MOLD FOR MOLDING AND METHOD FOR MOLDING USING THE MOLD
Document Type and Number:
Japanese Patent JPH11320617
Kind Code:
A
Abstract:

To provide a mold for molding by which molding of fine parts can be highly precisely performed and a method for molding using the mold.

A fixed mold 110 and a passage 121 for passing a molding raw material when it is filled under pressure are provided and a movable mold 120 which can be tightly stuck and separated to a fixed mold 110 is provided. In addition, a transfer mold 114 which is transferrably arranged in the fixed mold 110 by the pushing pressure of the above described molding raw material filled under pressure and forms a space with approximately the same shape as the outer shape of the above described molded body between the fixed mold 110 and a movable mold 114 after transferring is provided. In addition, a projected mold 115 which is fixed on the fixed mold 110 and is arranged in a through- hole 114a provided in the transfer mold 114 and is stored in the above described through-hole before the transfer mold is transferred and is projected into the above described space after it is transferred, is provided.


Inventors:
YANAI MINORU
TAWARA MASAKAZU
Application Number:
JP13347598A
Publication Date:
November 24, 1999
Filing Date:
May 15, 1998
Export Citation:
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Assignee:
SONY CORP
International Classes:
B29C33/76; B29C45/26; (IPC1-7): B29C45/26; B29C33/76
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)