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Patent Searching and Data


Title:
MOLD FOR MOLDING PLASTIC PRODUCT
Document Type and Number:
Japanese Patent JP3888449
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a mold for molding a plastic product which improves a mold releasability from the mold by forming a special layer on the surface of the mold.
SOLUTION: The mold for molding the plastic product comprises a coating layer 14 containing molybdenum sulfide, molybdenum disulfide or tungsten disulfide as a main component or a diffused layer formed partly or entirely on the surface of the mold brought into contact with the layer 14. Such a mold 10 is manufactured by pretreating such as cleaning and/or peening the surface of the mold, and then forming the coating layer 14 containing the molybdenum sulfide, the molybdenum disulfide or the tungsten disulfide as the main component.


Inventors:
Matsuhashi
Application Number:
JP2002129214A
Publication Date:
March 07, 2007
Filing Date:
April 30, 2002
Export Citation:
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Assignee:
Toyo Seikan Co., Ltd.
International Classes:
B29C33/38; B29C33/56; B29C33/72; B29C45/26; B29C45/37; B29C49/48; C23C10/30; (IPC1-7): B29C33/38; B29C33/72; B29C45/26; B29C49/48
Domestic Patent References:
JP58153608A
JP59101320A
JP11199889A
JP2000120739A
JP9194220A
JP6316945A
JP60138080A
JP59150085A
JP2002012885A
JP5239618A
JP2000015670A
JP2047032A
JP2003260285A
JP11189859A
Attorney, Agent or Firm:
Akio Ota