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Title:
MOLD FOR MOLDING RUBBER
Document Type and Number:
Japanese Patent JP2501708
Kind Code:
B2
Abstract:

PURPOSE: To provide a mold having improved corrosion resistance, release property, and high workability of rubber molding by forming an Ni film, as a first layer, an NiP film, as a second layer, and an NiPN film, as a third layer, on an area with which a rubber of the mold comes into contact, thus forming a layered structure.
CONSTITUTION: In a mold for use in molding rubber such as a hose of automobile, a belt for general purpose, etc., an Ni film, as a first layer, an NiP film, as a second layer, and an NiPW film, as a third layer, are formed over an area with which the rubber comes into contact to form a layered structure. And by applying Ni plating, adhesive property between the whole Ni film and a base material is maintained. And by means of the NiP film, adhesive property with the Ni film is improved and also stresses which cause cracks of the NiPW film due to the hardness thereof, not withstanding said hardness is effective to produce corrosion resistance and release property for the rubber, can be released. Consequently, corrosion resistance and release property are improved and hence a mold having excellent workability of rubber molding can be provided.


Inventors:
KASHIWADA KUNIO
NEGISHI SATOSHI
Application Number:
JP4892892A
Publication Date:
May 29, 1996
Filing Date:
March 05, 1992
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
B29C33/38; B29C45/37; C23C18/52; C23C28/00; B29K7/00; B29K9/00; (IPC1-7): B29C33/38; B29C45/37; C23C18/52; C23C28/00
Domestic Patent References:
JP1186309A
JP1168407A
JP4161308A
Attorney, Agent or Firm:
Masatake Shiga (2 outside)



 
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