Title:
MOLD PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015093475
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mold package by sealing a sealed component with a thermosetting resin member, and sealing the surface of the thermosetting resin member with a thermoplastic resin member, improved in adhesion properties between the thermosetting resin member and the thermoplastic resin member.SOLUTION: A mold package is manufactured by: heating a sealed component 10, while coating with a first thermoset resin material 21a having a first hardening temperature T1, in a state of coating the surface of the first thermoset resin material 21a with a second thermoset resin material 22a having a higher second hardening temperature T2, at a temperature equal to or more than the first hardening temperature T1 and less than the second hardening temperature T2, and putting the second thermoset resin material 22a into a semi-hardened state while hardening and completing the first thermoset resin material 21a; and heating the surface of a second thermoset resin material 22b in a semi-hardened state in a state of coating with a thermoplastic resin material 30a, and forming a thermoplastic resin member 30 while completing hardening of the second thermoset resin material 22b in a semi-hardened state.
Inventors:
YAMAKAWA HIROYUKI
Application Number:
JP2013235794A
Publication Date:
May 18, 2015
Filing Date:
November 14, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
B29C43/20; B29C39/18; B29C39/20; B29C43/18; H01L21/56
Domestic Patent References:
| JP2000293651A | 2000-10-20 | |||
| JP2000223623A | 2000-08-11 | |||
| JP2013101990A | 2013-05-23 | |||
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| JP2008153573A | 2008-07-03 | |||
| JPH11219984A | 1999-08-10 | |||
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Foreign References:
| US6157080A | 2000-12-05 | |||
| EP0915505A1 | 1999-05-12 | |||
| US20010002874A1 | 2001-06-07 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office