Title:
MOLD PACKAGE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3708236
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce cracks and chipping at the time of removing the gate part and cutting the island support from a mold package by forming the draft of a corner part positioned at the gate part within a prescribed range in molding the mold package.
SOLUTION: The bottom part draft θ of a corner 2c positioned at a gate part 4 is formed within a range of 20°-25°, at least at the time of molding a mold package 2. A draft θ of 20° is a limit value which prevents cracks and chipping in each cut. When the draft is increased, the corner 2c part is thinned and size increase of the mold package 2 is required. The limit value of 25° is obtained from experiment for evading the size increase. Thus cracks and chipping at the corner 2c part of the package generated at the time of removing the gate part 4 and cutting an island support for separating from the outer frame after molding are prevented.
Inventors:
Kenji Yoshida
Application Number:
JP19685196A
Publication Date:
October 19, 2005
Filing Date:
June 22, 1996
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/28; H01L21/56; (IPC1-7): H01L23/28; H01L21/56
Domestic Patent References:
| JP5190733A | ||||
| JP6041151U | ||||
| JP55165654A | ||||
| JP2250360A |
Attorney, Agent or Firm:
Katsuhiro Kawasaki