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Patent Searching and Data


Title:
MOLD OF PACKAGING APPARATUS
Document Type and Number:
Japanese Patent JPH11171111
Kind Code:
A
Abstract:

To provide a mold which can form a flat semi-package excellently.

The mold provided in a packaging apparatus for forming a semi-package 31 by applying a lower lateral seal on a cylindrical packaging material 1, filling liquid-like contents inside the packaging material from above the lower lateral seal and applying an upper lateral seal above the lower lateral seal holds the semi-package 31 while being formed in a desired shape at the time of applying the upper lateral seal. The mold includes inner peripheral faces 63a, 65a comprising a plurality of side pressing faces 69a, 71a, 75a and having an entirely flat lateral cross section, upper pressing faces 81c, 83c formed like slopes inclined upward from sides of the side pressing faces 69a, 71a, 75a and lower pressing faces 81b, 83b formed like slopes inclined downward from sides of the pressing faces 69a, 71a, 75a, while one of the side pressing faces 71a is formed like a curved face wherein an intermediate part in a vertical direction protrudes inward.


Inventors:
PETER MARUBE
ANDREA SERENI
KENT KUNUTTOSON
Application Number:
JP33602697A
Publication Date:
June 29, 1999
Filing Date:
December 05, 1997
Export Citation:
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Assignee:
NIHON TETRAPAK KK
International Classes:
B65B9/20; B65B9/213; B65B47/04; (IPC1-7): B65B9/20; B65B47/04
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)