Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLD POSITION DETECTION DEVICE, BENDING DEVICE, MOLD, AND METHOD FOR DETECTING POSITION OF MOUNTING MEMBER WITH RESPECT TO MOUNTED DEVICE
Document Type and Number:
Japanese Patent JP2014024118
Kind Code:
A
Abstract:

To provide a mold position detection device capable of accurately detecting the position of a mold mounted on a mold mounting part.

On the inner wall of a mold mounting part, a power feeding electrode 31 and a plurality of detection electrodes 32 are provided. When a mold having a power receiving electrode and a displacement electrode is mounted on the mold mounting part, the power feeding electrode 31 and the power receiving electrode face each other, and one of the plurality of detection electrodes 32 and the displacement electrode face each other. A pair comprising the power feeding electrode 31 and the power receiving electrode and a pair comprising the one of the plurality of detection electrodes 32 and the displacement electrode form a capacitor circuit. The capacitance of the capacitor circuit varies according to the position of the mold with respect to the longitudinal direction of the mold mounting part. A mold position detection unit 11 feeds an AC power feeding signal to the power feeding electrode 31. A voltage information extraction section 330 extracts voltage information which varies according to the capacitance of the capacitor circuit from the one of the plurality of detection electrodes 32. On the basis of the extracted voltage information, a position detection operation section 111 detects a position in the longitudinal direction of the mold mounting part where the mold is mounted.


Inventors:
GONDO MASAHIKO
ARISTOPHANE GOUDJANOU
SUGANO KAZUHIRO
Application Number:
JP2013099809A
Publication Date:
February 06, 2014
Filing Date:
May 10, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AMADA CO LTD
International Classes:
B21D5/02; B21D37/00
Domestic Patent References:
JP2005334973A2005-12-08
JPS62235503A1987-10-15
JP2005074446A2005-03-24
JP2001219221A2001-08-14
JPH0337517A1991-02-18
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu