Title:
MOLD PRESS DEVICE OF ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3033258
Kind Code:
B2
Abstract:
PURPOSE: To fit easily a matter to be fitted to the tip and bottom of a molded body.
CONSTITUTION: The present device is provided with a top and bottom forces 1, 2 and a mover 3 which is carried by moving devices 8, 28, 29, moved forward between the top and bottom forces 1, 2, and moved backward through a space between them. Matters to be fitted 5, 6 which are fitted to the top and bottom of a mold body M are fitted to the top and bottom of the mover 3 and suction devices sucking the matter to be fitted 5, 6 are provided on the top and bottom of the top force 1.
Inventors:
Shojiro Nishihara
Application Number:
JP18220591A
Publication Date:
April 17, 2000
Filing Date:
July 23, 1991
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B29C31/08; B29C33/14; B29C45/14; B29C45/26; H01L21/56; B29K105/20; B29L31/34; (IPC1-7): B29C45/26; B29C45/14; H01L21/56
Domestic Patent References:
| JP1163013A | ||||
| JP63246218A | ||||
| JP6270013A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)