MOLD RELEASABILITY IMPARTING COMPOSITION AND METHOD FOR MANUFACTURING MOLDED BODY

Japanese Patent JP2014008613

A

To provide a mold releasability imparting composition capable of effectively increase releasability when molding a molding material including an epoxy compound or silicone compound as a thermosetting component to obtain a molded body as a substrate for installing a semiconductor device that allows installation of a semiconductor device.

A mold releasability imparting composition 23 is used to impart releasablilty on a surface of a metal mold 21 before filling the metal mold 21 with a molding material 24 including an epoxy compound or a silicone compound as a thermosetting component and molding the molding material 24 into a molded body as a substrate for installing semiconductor device that allows installation of a semiconductor device. The mold releasability imparting composition 23 includes a thermosetting component and a release agent.

HIGUCHI ISAO
SHIKAGE TAKASHI
FUKUDA TAKASHI
YASUI HIDEFUMI
MORITA TAKEHARU
WATANABE TAKASHI
NAKAMURA HIDE

JP2012144527A

January 20, 2014

June 27, 2012

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SEKISUI CHEMICAL CO LTD

B29C33/62; B29C45/02; C08K3/36; C08L63/00; C08L83/04; C08L91/00; C08L91/06; H01L33/48

Patent business corporation Miya saki, table of contents patent office

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