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Title:
MOLD RELEASE AGENT, RESIN COMPOSITION AND RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2011057729
Kind Code:
A
Abstract:

To provide a mold release agent which improves releasability upon resin molding.

This mold release agent includes an unsaturated bond-containing polyolefin polymer having the unsaturated bond at a terminal of a main chain, in which a content of the unsaturated bond at a terminal of all pieces measured by 1H-NMR is ≥80%, and a number average molecular weight (Mn) measured by gel permeation chromatography (GPC) is ≥500 and ≤10,000.


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Inventors:
NAGAI SUNAO
SUZUKI MAKOTO
MATSUNO HIROZUMI
Application Number:
JP2009205335A
Publication Date:
March 24, 2011
Filing Date:
September 04, 2009
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L101/02; C08L23/00; C08L67/02; C08L69/00; C08L77/00; C08L101/00
Domestic Patent References:
JP2003073412A2003-03-12
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda



 
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