Title:
モールド除去方法
Document Type and Number:
Japanese Patent JP5137088
Kind Code:
B2
Abstract:
A laser mold removing method of the invention is for processing a composite material composed of a plurality of materials having different reflectances to a laser beam, and includes emitting laser beam in which a processing laser beam for processing the processing object and a measurement laser beam adapted to irradiate the processing object and having an output smaller than that of the processing laser beam are emitted, measuring a reflected light quantity of the measurement laser beam reflected by the processing object, and controlling based on the reflected light quantity.
Inventors:
Tsuneo Kurita
Kasashima Eikichi
Kasashima Eikichi
Application Number:
JP2009543783A
Publication Date:
February 06, 2013
Filing Date:
November 25, 2008
Export Citation:
Assignee:
National Institute of Advanced Industrial Science and Technology
International Classes:
B23K26/36; B23K26/00; H01L21/56
Domestic Patent References:
| JP2000126880A | 2000-05-09 | |||
| JP2001340980A | 2001-12-11 | |||
| JP2003045921A | 2003-02-14 | |||
| JP2000323506A | 2000-11-24 | |||
| JPH10199906A | 1998-07-31 | |||
| JPH05251490A | 1993-09-28 |
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Hironori Honda
Toshimitsu Ichikawa