Title:
MOLD FOR RESIN SEAL MOLDING
Document Type and Number:
Japanese Patent JP3383701
Kind Code:
B2
Abstract:
PURPOSE: To make uniform temperatures of parts of a flow of sealing resin, to shorten a tact of a sealing operation and thereby to obtain a mold for resin seal molding which is free from occurrence of a void and an unfilled part.
CONSTITUTION: A mold for resin seal molding which has a plurality of packaging parts 8 sealing an electric element with sealing resin and molding it, runners 3, 4 and 6 supplying the packaging parts 8 with the sealing resin which is heated in a pot not shown in Figs. and pushed out by a plunger not shown in Figs. and a cull part 2 positioned at the bottom of the pot and supplying each of the runners 3, 4 and 6 uniformly with the sealing resin pushed out from the pot. In the runners 3, 4 and 6, longitudinal wrinkles 3a, 4a and 6a directed toward the central part of a flow of the sealing resin in the runners from the inner wall surfaces of the runners are provided in the direction of the flow of the sealing resin.
Inventors:
Mitsuhiro Abe
Application Number:
JP3551594A
Publication Date:
March 04, 2003
Filing Date:
March 07, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B29C45/26; B29C45/02; B29C45/27; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/26; H01L21/56
Domestic Patent References:
| JP61274910A | ||||
| JP6230013A | ||||
| JP4147814A | ||||
| JP796536A | ||||
| JP4929859U | ||||
| JP61180712U | ||||
| JP62178118U |
Attorney, Agent or Firm:
Masaru Ishihara