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Patent Searching and Data


Title:
MOLD FOR SYNTHETIC RESIN MATERIAL AND OTHERS
Document Type and Number:
Japanese Patent JPH07186156
Kind Code:
A
Abstract:

PURPOSE: To provide a mold with a film having improved mold release characteristics, water repellency, oil repellency, lubricating properties, etc., by using a film prepd. by means of an electroless composite plating method.

CONSTITUTION: A mold for molding a synthetic resin material, etc., is prepd. by a method wherein a base material for the mold is immersed in a plating bath wherein fluororesin particles with characteristic shape and dimension are dispersed and electroless plating is performed to co-deposit the fluororesin particles on the surface of the base material of the mold.


Inventors:
MATSUBARA NAOKI
SUGIYAMA YOICHI
Application Number:
JP33340593A
Publication Date:
July 25, 1995
Filing Date:
December 27, 1993
Export Citation:
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Assignee:
MITSUI SHIPBUILDING ENG
International Classes:
B29C33/38; B29C33/58; B29K27/12; (IPC1-7): B29C33/38; B29C33/58
Attorney, Agent or Firm:
Shinichi Ogawa (2 outside)