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Patent Searching and Data


Title:
MOLD FOR SYNTHETIC RESIN
Document Type and Number:
Japanese Patent JPS6127212
Kind Code:
A
Abstract:

PURPOSE: To enable manufacture of a synthetic resin formed piece free from cloudiness, etc. and excellent in mirror finish by a method wherein a silicone- containing mold release film, a fluorine-containing mold release film or a polyolefin mold release film is provided by the plasma copolymerization method on the mold surface in contact with synthetic resin.

CONSTITUTION: Organic compound is used for the film material provided on the forming surface of a mold for synthetic resin. In this case, hexamethylene disiloxane, tetramethyl disiloxane, ethylene tetrafluoride, monochloro-ethylene-trifluoride propylene hexafluoride, ethylene, butylene, isobutylene, pentene, 2-methyl pentene, etc. are excellent in releasability from synthetic resin and adhesion to molds composed of metal, glass, ceramics, etc. The plasma copolymeric film of these monomers is provided with crosslinking structure to resist temperature 100°C or higher and a strong point of satisfying necessary properties as the mold releasing agent on a mold for three-dimensional hardening synthetic resin. The thickness of the film varies according to the material or usage of a formed piece but 500W3,000 is generally suitable.


Inventors:
TSUGE MORIO
MIKAMI SHINICHI
TAKEUCHI MASAHIRO
Application Number:
JP14859084A
Publication Date:
February 06, 1986
Filing Date:
July 19, 1984
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B29C33/38; B29C33/56; B29C33/58; C23C16/00; (IPC1-7): B29C33/38; B29C33/56