Title:
MOLD OF THERMALLY CURABLE RESIN AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0469216
Kind Code:
A
Abstract:
PURPOSE: To improve the durabilit of a mold significantly by forming a metal plated layer on the surface of a mold which forms a molded product in a specified shape.
CONSTITUTION: An electrically conductive resin layer 3 is formed on the surface of a mold which forms a molded product in a specified shape. Next, an electrolytic metal plating 2 is applied to the electrically conductive resin layer 3. Consequently it is possible to obtain an abrasion-resistant mold with a molding surface of thermally curable resin covered with a metal plated layer 2.
Inventors:
NAWAUMA KIYOSHI
ITOU KUNIAKI
ITOU KUNIAKI
Application Number:
JP18343890A
Publication Date:
March 04, 1992
Filing Date:
July 11, 1990
Export Citation:
Assignee:
ITO KUNIAKI
NAWAUMA KIYOSHI
NAWAUMA KIYOSHI
International Classes:
B21D37/01; B21D37/20; B29C33/40; B29C70/06; (IPC1-7): B21D37/01; B21D37/20; B29C33/40; B29C67/14
Domestic Patent References:
| JPS57159610A | 1982-10-01 | |||
| JPS5337760B2 | 1978-10-11 | |||
| JPS5238614U | 1977-03-18 | |||
| JPS63230308A | 1988-09-26 | |||
| JPH03126508A | 1991-05-29 |
Attorney, Agent or Firm:
Hidehiko Okada (3 others)
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