PURPOSE: To correct temperature characteristics of a film resistor without use of a temperature compensation circuit by constructing a substrate and mold resin with materials of different linear expansion coefficients and deflecting the substrate such that the temperature characteristics of the film resistor are reduced owing to hardening of the resin.

CONSTITUTION: An insulating substrate 1 is molded along its periphery with resin 5 of a larger linear expansion coefficient than the substrate 1. The substrate 1 has a curved convex upper surface on which a resistor 3 is formed. The substrate 1 is deflected owing to stress or the like upon resin being hardened so as to provide the convex upper surface. Since the substrate 1 is molded, keeping its upwardly-deflected state, any tension is exserted on the resistor 3 formed on the substrate 1 when a product is complete to slightly increase an initial resistance of the resistor 3. The resistor 3 after the substrate has been molded with the resin has a larger gradient of the increase of the resistance with respect to the temperature compared with the same situation before the resin-molding. Hereby, temperature characteristics are corrected without requiring a temperature compensation circuit.