MOLD UNDERFILL COMPOSITION FOR TSV

Title:

MOLD UNDERFILL COMPOSITION FOR TSV

Document Type and Number:

Japanese Patent JP2023109410

Kind Code:

A

Abstract:

To provide a liquid epoxy resin composition which has good injection property, gives a cured product providing an electronic component preventing short circuit in a bias HAST test, and can impart sufficient reliability to an electronic component including high-density wiring formed by a technique such as TSV.SOLUTION: A mold underfill composition for TSV contains (A) an epoxy resin, (B) a curing agent, (C) a filler, and (D) carbon black, in which (A) the epoxy resin contains a specific aliphatic epoxy resin, (C) the filler has specific particle size distribution, and contents of the carbon black and chloride ions (Cl-) are within predetermined ranges. An electronic component including a cured product obtained by curing the mold underfill composition for TSV prevents short circuit for a long time in a bias HAST test performed under a predetermined condition.SELECTED DRAWING: None

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Inventors:

KIM MIN SUK
KIM TAE HOON
PARK JONG HYOCK
KAMIMURA TAKESHI
SAKAI YOSUKE
SUZUKI MAKOTO

Application Number:

JP2022010900A

Publication Date:

August 08, 2023

Filing Date:

January 27, 2022

Export Citation:

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Assignee:

SK HYNIX INC
NAMICS CORP

International Classes:

C08G59/24; C08K3/013; C08L63/00; C09K3/10; H01L21/56; H01L23/29

Attorney, Agent or Firm:

Patent Attorney Corporation Tsukuni

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