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Patent Searching and Data


Title:
MOLD FOR WHICH ALUMINUM ALLOY IS USED
Document Type and Number:
Japanese Patent JPH01314127
Kind Code:
A
Abstract:

PURPOSE: To make return of ejection pin perfect by preventing generation of a dent in a template due to a collision of a return pin with the template, by a method wherein the tip of a movable pin embedded along with a heavy-duty spring into a stationary side template is ejected through the surface of the template and the return pin is driven against an ejected part.

CONSTITUTION: A movable pin 11 is embedded into a stationary side temperature 2 fitted to a fixed head die plate along with a heavy-duty spring 10 and the tip of the movable pin 11 is ejected through the surface of the stationary side template 2. When mold clamping is performed, the movable pin 11 presses the tip of the return pin 13 ejected through the movable side template 3 and pushed down ejector plates 5, 6. With this construction, since the return pin 13 does not come into contact directly with the stationary side template comprised of an aluminum alloy and pushed up the movable pin 11 embedded into the stationary side template along with the spring 10, it does not happen that the return pin 13 generates a dent in the stationary side template 2. Therefore, the ejector plates 5, 6 are returned to the original position and the tip of the ejector pin 12 is held on the surface flush with the surface of a core 8.


Inventors:
SERIZAWA YOSHIMI
Application Number:
JP14576188A
Publication Date:
December 19, 1989
Filing Date:
June 15, 1988
Export Citation:
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Assignee:
HITACHI LIGHTING LTD
International Classes:
B22D17/22; B29C33/44; B29C45/40; (IPC1-7): B22D17/22; B29C33/44; B29C45/40
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)