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Title:
MOLD FOR WIRE HARNESS
Document Type and Number:
Japanese Patent JP2012190757
Kind Code:
A
Abstract:

To take out a wire harness from a mold to cool the wire harness promptly after molding, in the mold used when a covering material is obtained by filling an electric wire group of the wire harness around which nonwoven fabric is wound in the mold and heating and hardening the nonwoven fabric.

An intermediate mold is interposed between a lower mold and an upper mold. The intermediate mold has opened upper and lower sides and includes mold surfaces abutting on both side faces of a covering material of an electric wire group. After nonwoven fabric is heated and hardened, the upper mold is released. The electric wire group covered with the covering material is nipped between the mold surfaces of the intermediate mold, so as to enable the electric wire group to be drawn out from the lower mold.


Inventors:
SEOK WEN-CHIEH
Application Number:
JP2011055642A
Publication Date:
October 04, 2012
Filing Date:
March 14, 2011
Export Citation:
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Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H01B13/012; B29C33/12; B29K105/22; B29L9/00; B29L31/34
Attorney, Agent or Firm:
大和田 和美



 
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