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Patent Searching and Data


Title:
MOLD
Document Type and Number:
Japanese Patent JP59106918
Kind Code:
A
Abstract:

PURPOSE: To improve the releasing property of a mold and the durability thereof by a method wherein plated film in which fluororesin grains are eutectic is formed on the surface facing a molding cavity and fluororesin grains exposed on the surface and fluororesin supplied are softened and melted to form a fluororesin film layer.

CONSTITUTION: Grains 5' exposed on the eutectic plated film 3 of fluororesin grains formed on the cavity surface 2 of a mold body 1 and fluororesin newly supplied to the plated film 3 are heated and melted to form a fluororesin film layer 6. Tetrafluoride ethylene chloride resin, tetrafluoride ethylene-hexafluoride propylene copolymeric resin, trifluoride ethylene chloride resin, fluoride vinylidene resin, fluoride vinyl resin, etc. are applied independently or in combination. A suitable metal is selected according to uses etc. as the matrix 4 of the plated film 3. This resin film layer mold can be applied to ingection, extrusion, blow molding or casting of plastics, rubber, glass, etc.


Inventors:
Naito, Kuniko
Matsumura, Muneyori
Araki, Ken
Application Number:
JP1983000191554
Publication Date:
June 20, 1984
Filing Date:
October 13, 1983
Export Citation:
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Assignee:
C UYEMURA & CO LTD
International Classes:
B29C33/00; B29C33/38; B29C33/56; B29C33/60; B29C33/00; B29C33/38; B29C33/56; (IPC1-7): B29C1/04