MOLDED BOARD WHEREIN GRAIN HUSK IS USED AND MANUFACTURE OF THE SAME

Title:

MOLDED BOARD WHEREIN GRAIN HUSK IS USED AND MANUFACTURE OF THE SAME

Document Type and Number:

Japanese Patent JPH1015920

Kind Code:

A

Abstract:

To provide a molded board wherein grain husk and a foamable phenol resin are used and a method for manufacturing it.

This molded board comprises a foamable phenol resin 1, grain husk and mat-like fiber 3 and the foamable phenol resin 1 and the grain husk 2 sprayed on the mat-like fiber 3 after mixing or into a layer is heated at a temp. being at least the softening temp. and at most the foaming temp. of the foamable phenol resin 1 to obtain a prepreg. The prepreg alone or a plurality of the prepregs being laminated are heated and pressed to obtain an aimed molded board. As no glass fiber is used, there exists no possibility of making working environment worse during manufacturing process and used board is easily reused.

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Inventors:

KATO KATSUMI
MORITA SEIJI
ANDO MASAMI
NAKAYAMA TAKENARI

Application Number:

JP18674096A

Publication Date:

January 20, 1998

Filing Date:

June 27, 1996

Export Citation:

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Assignee:

GUNEI KAGAKU KOGYO KK

International Classes:

B27N3/00; B27N3/06; B29C70/06; B32B9/02; B32B27/42; B29K61/04; B29K105/04; B29K105/08; B29L9/00; B29L31/10; B29L31/44; B29L31/58; (IPC1-7): B27N3/06; B29C70/06; B32B9/02; B32B27/42

Attorney, Agent or Firm:

Shimoyama Fujio

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