Title:
成型体及びその製造方法
Document Type and Number:
Japanese Patent JP7306233
Kind Code:
B2
Abstract:
The molded body according to one aspect of the present disclosure is a molded body obtained by molding resin and used by allowing light to pass through the resin. This molded body includes: a plurality of gate marks each being as a mark of a gate through which the resin was injected during the molding; and a weld part disposed in such a manner as to avoid a position where the light passes through the resin.
Inventors:
Rentaro Akimoto
Application Number:
JP2019208134A
Publication Date:
July 11, 2023
Filing Date:
November 18, 2019
Export Citation:
Assignee:
株式会社デンソー
International Classes:
B29C45/27; B29C45/14
Domestic Patent References:
| JP2013137412A | ||||
| JP6328499A | ||||
| JP2008105328A |
Foreign References:
| WO2011111242A1 |
Attorney, Agent or Firm:
Nagoya International Patent Attorney Corporation