Title:
MOLDING AND TREATMENT METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2023062276
Kind Code:
A
Abstract:
To provide a molding which can suppress stickiness regardless of manufacturing environment and storage environment of the molding, and a treatment method of a molding which can suppress stickiness while exhibiting a good effect by an additive.SOLUTION: A molding is composed of a resin composition containing a thermoplastic resin and an additive having bleeding property, wherein an additive content in the resin composition is an amount such that an effect by the additive after the molding has been heated for a predetermined time is better than an effect by the additive in the molding immediately after molding.SELECTED DRAWING: Figure 1
Inventors:
ONO TERUYUKI
TEZUKA YASUSHI
OSAWA MASASHI
TEZUKA YASUSHI
OSAWA MASASHI
Application Number:
JP2021172151A
Publication Date:
May 08, 2023
Filing Date:
October 21, 2021
Export Citation:
Assignee:
FUKUSUKE KOGYO CO LTD
International Classes:
C08L101/00; C08J5/18; C08L23/00
Attorney, Agent or Firm:
Shuzo Hiranae
Takayasu Kobane
Kiyotaka Fujiwara
Takayasu Kobane
Kiyotaka Fujiwara
Previous Patent: Locking device for delivery boxes
Next Patent: Polytriarylamine compound, power generation device and method for producing the same
Next Patent: Polytriarylamine compound, power generation device and method for producing the same