Title:
モールド型コンデンサとその製造方法
Document Type and Number:
Japanese Patent JP5370364
Kind Code:
B2
Abstract:
A molded capacitor includes a capacitor-element assembly, a package covering the capacitor-element assembly, and a supporter embedded in the package. The capacitor-element assembly includes a capacitor element having a first electrode, and a busbar joined to the electrode of the capacitor element. The busbar has a terminal. The package is made of norbornene-based resin and covers the capacitor-element assembly while exposing the terminal of the busbar. The supporter has first and second end section and is made of heat-conductive insulating material. The first end section contacts the capacitor-element assembly. The second end section is exposed from the package. This molded capacitor has high heat resistance and a small, light-weighted body, and can be manufactured inexpensively.
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Inventors:
Hiroki Takeoka
Hiroshi Kubota
Yukihiro Shimazaki
Hiroshi Fujii
Yukazu Daichi
Hiroshi Kubota
Yukihiro Shimazaki
Hiroshi Fujii
Yukazu Daichi
Application Number:
JP2010519632A
Publication Date:
December 18, 2013
Filing Date:
July 01, 2009
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01G2/08; H01G2/10; H01G4/18; H01G4/224
Domestic Patent References:
| JP2008130640A | 2008-06-05 | |||
| JPH09134848A | 1997-05-20 |
Foreign References:
| WO2008078491A1 | 2008-07-03 |
Attorney, Agent or Firm:
Hiroki Naito
Kentaro Fujii
Ikuro Terauchi
Kentaro Fujii
Ikuro Terauchi