Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDED FORM REMOVING APPARATUS
Document Type and Number:
Japanese Patent JP2004034498
Kind Code:
A
Abstract:

To provide a molded form removing apparatus capable of shortening a removing time for the molded form by controlling vibration when a chuck is penetrated into a mold or transferred to a released position.

The molded form is taken out from a resin molding machine by transfer controlling of a holding component. There are provided a servomotor for transferring the held form in a specific direction; a positional detector which is provided at the servomotor to detect a transfer position of the holding component; a vibration detecting means for detecting vibration of the holding component; and a control means wherein the holding component is controlled in high speed transfer when transfer of the holding component is started, the holding component is controlled in low speed transfer by deceleration control when the holding component moves to a low speed starting position before a stop position based on a positional detecting signal from the positional detector and besides, the holding component is controlled to be stopped at a specific target position when vibration of the holding component is converged by a vibration detection means in transfer at a low speed.


Inventors:
YOKOTA HISAMI
Application Number:
JP2002194474A
Publication Date:
February 05, 2004
Filing Date:
July 03, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
STAR SEIKI KK
International Classes:
B29C45/42; B29C33/44; B29C45/76; (IPC1-7): B29C45/42; B29C33/44; B29C45/76
Attorney, Agent or Firm:
Kenichi Ito