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Patent Searching and Data


Title:
MOLDED MATERIAL
Document Type and Number:
Japanese Patent JPH08217829
Kind Code:
A
Abstract:

PURPOSE: To obtain a molded material having excellent mechanical strength, excellent molding and processing property without lowering mechanical strength in co-using with other hydrophobic resin and useful for fibers, a film, a tube ore a drip-proof film, etc., by including a specific modified PVA-based resin.

CONSTITUTION: This molded material contains a PVA-based resin comprising a copolymer containing (A) 0.1-20mol% a compound of the formula [R1 is H or methyl; R2-R4 are each an alkyl or an aryl; R5 is H or R2; total number of C in R2-R5 is ≥4] (e.g. N-tert-octylacrylamide) and (B) 0.1-20mol% an ethylenic unsaturated carboxylic acid (salt) [e.g. (meth)acrylic acid, a maleic acid monoester] as copolymer components. This molded material can contain together with a polyamide-based resin, a polyolefin-based resin, a polyester-based resin or a PVC-based resin, etc., as a hydrophobic resin.


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Inventors:
MIYAMOTO YOSHIHIKO
Application Number:
JP4912595A
Publication Date:
August 27, 1996
Filing Date:
February 13, 1995
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
C08L23/00; C08F16/02; C08F216/06; C08F218/08; C08F220/04; C08F222/02; C08L27/06; C08L29/00; C08L29/04; C08L67/00; C08L77/00; (IPC1-7): C08F216/06; C08F220/04; C08F222/02; C08L29/04