Title:
MOLDED OBJECT AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JPH05230246
Kind Code:
A
Abstract:
PURPOSE:To improve surface hardness, adhesion, and durability by applying a silicon compound on a specific polymer surface having acid groups and converting the compound into a silica polymer through polycondensation to form a covering layer. CONSTITUTION:A composition containing at least 30wt.% polyfunctional monomer having two or more (meth)acryloyloxy groups per molecule is applied to the surface of a molding of an organic material and the monomer is polymerized to form a polymer layer having a thickness of 1mum or larger. The surface of the layer is irradiated with ultraviolet having a wavelength of 300nm or shorter and them immersed in a 0.1-50wt.% aqueous alkali solution at 0-100 deg.C for 0.01-100hr to generate acid groups in an amount of 0.02mumol/cm<2> or larger on the surface. The acid groups are covered with a silicon compound represented by the formula XaSi(OY)4-a (wherein X is an organic functional group containing an epoxy group, Y is a hydrocarbon group, and a is 1-3). The compound is subjected to hydrolysis and polycondensation in the presence of a perchloric acid compound, water, and an organic solvent to form a covering layer of a silica polymer.
Inventors:
UENISHI MICHIHARU
NAGAI SHOICHI
TAKEI MASATOSHI
KOBAYASHI YUKIO
AKAGI YUJI
NAGAI SHOICHI
TAKEI MASATOSHI
KOBAYASHI YUKIO
AKAGI YUJI
Application Number:
JP3648492A
Publication Date:
September 07, 1993
Filing Date:
February 24, 1992
Export Citation:
Assignee:
MITSUBISHI RAYON CO
International Classes:
B44C3/02; C08J7/00; C08J7/04; C09D4/00; C09D4/02; (IPC1-7): B44C3/02; C08J7/00; C08J7/04; C09D4/02