Title:
MOLDED PARTS AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3758484
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide molded parts which are free from the generation of cracks in a resin molded part when a gate is cut after the formation of the resin molded part using a molding material as well as a manufacturing method therefor.
SOLUTION: The molded parts 10 are structured of the electronic parts which are inserted into a space between the lead frames 13 and 14 arranged at both ends and molded in resin. At least the lead frames 13 arranged at the both ends is an electrode terminal 13 exposed from the resin molded part 15, while the other lead frame 14 is a dummy terminal 14, which has a horizontal part whose tip is horizontally exposed to the outside from a spot near the lower end of the resin molded part 15. The horizontal part has at least parts 14c and 14c exposed to the outside from the resin molded part 15, split in two halves in the horizontal direction.
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Inventors:
Kazuhiko Shimodaira
Application Number:
JP2000265598A
Publication Date:
March 22, 2006
Filing Date:
September 01, 2000
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03H9/02; H05K5/00; B29C45/14; B29C45/26; H01L21/56; B29K105/22; B29L31/34; (IPC1-7): B29C45/26; B29C45/14; H05K5/00; //B29K105:22; B29L31:34
Domestic Patent References:
| JP9199971A | ||||
| JP5014107A | ||||
| JP3119810A | ||||
| JP2002067097A | ||||
| JP9246446A | ||||
| JP4060416U |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Osamu Suzawa