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Title:
MOLDED PRODUCT
Document Type and Number:
Japanese Patent JPH05191003
Kind Code:
A
Abstract:

PURPOSE: To easily and completely conduct an inserting and soldering operation of a lead pin by handwork by a method wherein one of the opening parts of a through hole, to be used to insert the lead pin of an electronic part, is made wider than the other opening part, or the above-mentioned opening part is made wider than the center part.

CONSTITUTION: A through hole 12, having cross-section in thickness direction, is provided on a molded article 1. A metal layer 13 is formed by non-electrolytic plating. The lead pin 15 of an electronic part is inserted by handwork, and it is soldered by handwork from the same side at a temperature of 300°C for three seconds. One side of the aperture part of the through hole 12, provided on the molded article 1, is made wider than the other side, or at least one side of the aperture part is made wider than the center part for the convenience of insertion and soldering of the lead pin 15. As a result, the insertion and soldering operation of the lead pin can be conducted by hand easily and completely.


Inventors:
KOMAGINE RIKIO
OAKU TOSHIYUKI
ANDO YOSHIYUKI
ASANO HIDEKI
Application Number:
JP2047792A
Publication Date:
July 30, 1993
Filing Date:
January 09, 1992
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
H05K1/02; H05K1/11; H05K1/18; H05K3/34; H05K3/42; (IPC1-7): H05K1/02; H05K1/11; H05K1/18
Attorney, Agent or Firm:
Tadao Hirata (2 outside)



 
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