PURPOSE: Titled molded resin with enhanced heat resisting characteristics, which is prepared by filling a mixture of an epichlorhydrin-bisphenol A type resin and two kinds of specified epoxy resins, with a quartz powder, followed by curing.

CONSTITUTION: A molded resin, which is prepared by filling a mixture of (A) an epichlorhydrin-bisphenol A type epoxy resin of formula I (wherein n is an integer), (B) an epoxy resin primarily composed of 1-glycidyl-3-(2-glycidyloxypropyl)-5,5- dimethyl hydantoin of formula II and (C) an epoxy resin primarily composed of diglycidyl (diaminodiphenyl)methane of formula III, with (D) a quartz powder, followed by curing. It is preferable to use a mixture of 50W70pts.wt. (hereinafter referred to as pts.) of the components (A), 25W45pts. of the component (B) and 5W25pts. of the component (C), and to mix 300W500pts. of the component (D) with 100pts. of said mixture.