Title:
MOLDED RESIN
Document Type and Number:
Japanese Patent JP2004059918
Kind Code:
A
Abstract:
To provide a molded resin having excellent mechanical properties, dimensional stability, thermal resistance, fire resistance or the like and especially excellent high-temperature properties, and a resin substrate material obtained therefrom.
The molded resin comprises at least one kind of resin selected from the group consisting of a thermoplastic resin, a thermosetting resin, a photocuring resin and a cured resin, as well as phyllosilicate, wherein, a normal vector at the layer surface of at least 50% or more of the above phyllosilicate orientates at an angle of 60° to 90° to the orientation axis.
Inventors:
SHIRAHASE KAZUTAKA
SHIRATO HITOSHI
SHIBAYAMA KOICHI
SHIRATO HITOSHI
SHIBAYAMA KOICHI
Application Number:
JP2003164149A
Publication Date:
February 26, 2004
Filing Date:
June 09, 2003
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L101/00; C08K7/00; (IPC1-7): C08L101/00; C08K7/00