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Title:
MOLDING APPARATUS AND GAS COMPRESSION MOLDING PROCESS
Document Type and Number:
Japanese Patent JP2011235354
Kind Code:
A
Abstract:

To provide a molding apparatus of a multilayered structure having a plurality of die cavities.

One or more constraining members each pulls both a stripper 20 provided in a molding die 12 and an adjacent sealing die 32 at two ends to strip a molded article and confine a distance between two dies 12, 16. Further, during a molding process, each of a plurality of plates is disposed between the two dies 12, 16. The molding apparatus 10 can be closed gradually. After molding, the molding apparatus 10 can be opened gradually. When the stripper 20 provided in the molding die 12 and the sealing die 32 are both moved and held by the two ends of the constraining member, respectively, the stripper in each molding die is pulled out by a ring-shaped buckle, and thereby the molded article is stripped. Accordingly, a plurality of molded articles can be obtained in one molding process.


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Inventors:
HSU PO-NAN
LIU KUN-SHENG
WU CHE-TUNG
YANG JUI-HUNG
Application Number:
JP2010203599A
Publication Date:
November 24, 2011
Filing Date:
September 10, 2010
Export Citation:
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Assignee:
ICHIA TECH INC
International Classes:
B21D26/031; B21J1/06; B21J13/14; B29C43/36; B29C51/30; B30B5/00
Domestic Patent References:
JPH06190466A1994-07-12
JP2007321783A2007-12-13
JP2001150046A2001-06-05
Foreign References:
TW342934B
Attorney, Agent or Firm:
Longhua International Patent Service Corporation